Intel Optimistic About Its Next-Gen 7nm Process Technology – Slashdot

From a report: Originally planned to enter mass production in the second half of 2016, Intel’s 10 nm process technology is still barely used by the company today. Currently the process is used to produce just a handful of CPUs, ahead of an expected ramp to high-volume manufacturing (HVM) only later in 2019. Without a doubt, Intel suffered delays on its 10 nm process by several years, significantly impacting the company’s product lineup and its business. Now, as it turns out, Intel’s 10 nm may be a short-living node as the company’s 7 nm tech is on-track for introduction in accordance with its original schedule.

For a number of times Intel said that it set too aggressive scaling/transistor density targets for its 10 nm fabrication process, which is why its development ran into problems. Intel’s 10 nm manufacturing tech relies exclusively on deep ultraviolet lithography (DUVL) with lasers operating on a 193 nm wavelength. To enable the fine feature sizes that Intel set out to achieve on 10 nm, the process had to make heavy usage of mutli-patterning. According to Intel, a problem of the process was precisely its heavy usage of multipatterning (quad-patterning to be more exact).

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